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Reliability challenges for copper low-k dielectrics and copper diffusion barriers

dc.contributor.authorTokei, Zsolt
dc.contributor.authorLi, Yunlong
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T05:45:17Z
dc.date.available2021-10-16T05:45:17Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11326
dc.sourceIIOimport
dc.titleReliability challenges for copper low-k dielectrics and copper diffusion barriers
dc.typeJournal article
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1436
dc.source.endpage1442
dc.source.journalMicroelectronics Reliability
dc.source.issue9_11
dc.source.volume45
imec.availabilityPublished - open access
imec.internalnotesPaper from the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis; Oct. 200; Bordeaux


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