Show simple item record

A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure

dc.contributor.authorVanstreels, Kris
dc.contributor.authorD'Olieslaeger, Marc
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorD'Haen, Jan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T06:40:10Z
dc.date.available2021-10-16T06:40:10Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11482
dc.sourceIIOimport
dc.titleA new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorD'Olieslaeger, Marc
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewno
dc.source.beginpage753
dc.source.endpage759
dc.source.journalMicroelectronics Reliability
dc.source.issue3_4
dc.source.volume45
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record