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Integration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies

dc.contributor.authorCarchon, Geert
dc.contributor.authorJourdain, Anne
dc.contributor.authorVendier, Olivier
dc.contributor.authorSchoebel, Joerg
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-16T15:13:23Z
dc.date.available2021-10-16T15:13:23Z
dc.date.issued2007-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11827
dc.sourceIIOimport
dc.titleIntegration of 0/1-level packaged RF-MEMS devices on MCM-D at millimeter-wave frequencies
dc.typeJournal article
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage369
dc.source.endpage376
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue3
dc.source.volume30
imec.availabilityPublished - imec


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