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Surface current modelling of the skin effect for on-chip interconnections

dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorRogier, H.
dc.contributor.authorKnockaert, Luc
dc.contributor.authorSercu, J.
dc.date.accessioned2021-10-16T15:40:09Z
dc.date.available2021-10-16T15:40:09Z
dc.date.issued2007-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12012
dc.sourceIIOimport
dc.titleSurface current modelling of the skin effect for on-chip interconnections
dc.typeJournal article
dc.contributor.imecauthorDe Zutter, Daniel
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage342
dc.source.endpage349
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue2
dc.source.volume30
imec.availabilityPublished - open access


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