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Surface diffusion of copper on tantalum substrates by Ostwald ripening

dc.contributor.authorFillot, Frederic
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-16T16:07:26Z
dc.date.available2021-10-16T16:07:26Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12154
dc.sourceIIOimport
dc.titleSurface diffusion of copper on tantalum substrates by Ostwald ripening
dc.typeJournal article
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage986
dc.source.endpage993
dc.source.journalSurface Science
dc.source.issue4
dc.source.volume601
imec.availabilityPublished - open access


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