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Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions

dc.contributor.authorLabie, Riet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVan Humbeeck, Jan
dc.date.accessioned2021-10-16T17:14:06Z
dc.date.available2021-10-16T17:14:06Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12426
dc.sourceIIOimport
dc.titleSolid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
dc.typeJournal article
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewno
dc.source.beginpage396
dc.source.endpage403
dc.source.journalIntermetallics
dc.source.issue3
dc.source.volume15
imec.availabilityPublished - imec


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