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Flight qualification and circuit development of sensor front-end electronics for PACS/Hershel at liquid helium temperature

dc.contributor.authorMerken, Patrick
dc.contributor.authorSouverijns, Tim
dc.contributor.authorPutzeys, Jan
dc.contributor.authorCreten, Ybe
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-16T17:55:53Z
dc.date.available2021-10-16T17:55:53Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12572
dc.sourceIIOimport
dc.titleFlight qualification and circuit development of sensor front-end electronics for PACS/Hershel at liquid helium temperature
dc.typeJournal article
dc.contributor.imecauthorPutzeys, Jan
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecPutzeys, Jan::0000-0001-8834-5852
dc.source.peerreviewno
dc.source.beginpage130
dc.source.endpage135
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.issue4
dc.source.volume4
imec.availabilityPublished - imec


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