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dc.contributor.authorOprins, Herman
dc.contributor.authorNicole, Céline
dc.contributor.authorVan der Veken, Geert
dc.contributor.authorLasance, Clemens
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-16T18:20:22Z
dc.date.available2021-10-16T18:20:22Z
dc.date.issued2007-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12649
dc.sourceIIOimport
dc.titleOn-chip liquid cooling with integrated pump technology
dc.typeJournal article
dc.contributor.imecauthorOprins, Herman
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.source.peerreviewno
dc.source.beginpage209
dc.source.endpage217
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue2
dc.source.volume30
imec.availabilityPublished - imec


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