On-chip liquid cooling with integrated pump technology
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Nicole, Céline | |
dc.contributor.author | Van der Veken, Geert | |
dc.contributor.author | Lasance, Clemens | |
dc.contributor.author | Baelmans, Martine | |
dc.date.accessioned | 2021-10-16T18:20:22Z | |
dc.date.available | 2021-10-16T18:20:22Z | |
dc.date.issued | 2007-06 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12649 | |
dc.source | IIOimport | |
dc.title | On-chip liquid cooling with integrated pump technology | |
dc.type | Journal article | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.source.peerreview | no | |
dc.source.beginpage | 209 | |
dc.source.endpage | 217 | |
dc.source.journal | IEEE Trans. Components and Packaging Technologies | |
dc.source.issue | 2 | |
dc.source.volume | 30 | |
imec.availability | Published - imec |
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