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Low temperature RTP for BCB curing

dc.contributor.authorOuaknine, Michel
dc.contributor.authorMalik, Igor J.
dc.contributor.authorOdera, Masato
dc.contributor.authorIshigaki, Toshikazu
dc.contributor.authorUeda, Takeshi
dc.contributor.authorFukada, Takashi
dc.contributor.authorYoo, Woo Sik
dc.contributor.authorSoussan, Philippe
dc.contributor.authorMuller, Philippe
dc.date.accessioned2021-10-16T18:24:37Z
dc.date.available2021-10-16T18:24:37Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12662
dc.sourceIIOimport
dc.titleLow temperature RTP for BCB curing
dc.typeJournal article
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorMuller, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage2646
dc.source.endpage2652
dc.source.journalMicroelectronic Engineering
dc.source.issue11
dc.source.volume84
imec.availabilityPublished - open access


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