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III-V/Si photonics by die-to-wafer bonding

dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Campenhout, J.
dc.contributor.authorBrouckaert, Joost
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorBaets, Roel
dc.contributor.authorRojo Romeo, P.
dc.contributor.authorRegreny, P.
dc.contributor.authorKazmierczak, A.
dc.contributor.authorSeassal, C.
dc.contributor.authorLetartre, X.
dc.contributor.authorHollinger, G.
dc.contributor.authorFedeli, J.M.
dc.contributor.authorDi Cioccio, L.
dc.contributor.authorLagahe-Blanchard, C.
dc.date.accessioned2021-10-16T19:04:34Z
dc.date.available2021-10-16T19:04:34Z
dc.date.issued2007-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12786
dc.sourceIIOimport
dc.titleIII-V/Si photonics by die-to-wafer bonding
dc.typeJournal article
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage36
dc.source.endpage43
dc.source.journalMaterials Today
dc.source.issue7_8
dc.source.volume10
imec.availabilityPublished - open access


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