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Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,

dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorLimaye, Paresh
dc.contributor.authorRatchev, Petar
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-16T21:06:52Z
dc.date.available2021-10-16T21:06:52Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13130
dc.sourceIIOimport
dc.titleThermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage259
dc.source.endpage265
dc.source.journalMicroelectronics Reliability
dc.source.issue2_3
dc.source.volume47
imec.availabilityPublished - imec


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