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Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

dc.contributor.authorZhao, Chao
dc.contributor.authorTokei, Zsolt
dc.contributor.authorHaider, A.
dc.contributor.authorDemuynck, Steven
dc.date.accessioned2021-10-16T22:01:38Z
dc.date.available2021-10-16T22:01:38Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13268
dc.sourceIIOimport
dc.titleFailure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications
dc.typeJournal article
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage2669
dc.source.endpage2674
dc.source.journalMicroelectronic Engineering
dc.source.issue11
dc.source.volume84
imec.availabilityPublished - open access
imec.internalnotesPaper from MAM 2007


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