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Copper CMP with composite polymer core – silica shell abrasives: a defectivity study

dc.contributor.authorArmini, Silvia
dc.contributor.authorWhelan, Caroline
dc.contributor.authorMoinpour, Mansour
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-17T06:14:10Z
dc.date.available2021-10-17T06:14:10Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13317
dc.sourceIIOimport
dc.titleCopper CMP with composite polymer core – silica shell abrasives: a defectivity study
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage1079-N11-04
dc.source.conferenceMaterials and Processes for Advanced Interconnects for Microelectronics
dc.source.conferencedate24/03/2008
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://www.mrs.org/s_mrs/sec_subscribe.asp?CID=12434&DID=205509
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1079E


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