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Towards 3D integration of system in a package modules

dc.contributor.authorCarchon, Geert
dc.contributor.authorPosada Quijano, Guillermo
dc.date.accessioned2021-10-17T06:26:40Z
dc.date.available2021-10-17T06:26:40Z
dc.date.issued2008
dc.identifier.issn1751-1135
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13478
dc.sourceIIOimport
dc.titleTowards 3D integration of system in a package modules
dc.typeJournal article
dc.source.peerreviewno
dc.source.beginpage37
dc.source.endpage40
dc.source.journalEuroasia Semiconductor
dc.source.issue1
dc.source.volume30
imec.availabilityPublished - imec


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