Towards 3D integration of system in a package modules
dc.contributor.author | Carchon, Geert | |
dc.contributor.author | Posada Quijano, Guillermo | |
dc.date.accessioned | 2021-10-17T06:26:40Z | |
dc.date.available | 2021-10-17T06:26:40Z | |
dc.date.issued | 2008 | |
dc.identifier.issn | 1751-1135 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13478 | |
dc.source | IIOimport | |
dc.title | Towards 3D integration of system in a package modules | |
dc.type | Journal article | |
dc.source.peerreview | no | |
dc.source.beginpage | 37 | |
dc.source.endpage | 40 | |
dc.source.journal | Euroasia Semiconductor | |
dc.source.issue | 1 | |
dc.source.volume | 30 | |
imec.availability | Published - imec |
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