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Broadband material parameter characterization for practical high-speed interconnects on printed circuit board

dc.contributor.authorCauwe, M.
dc.contributor.authorDe Baets, Johan
dc.date.accessioned2021-10-17T06:27:19Z
dc.date.available2021-10-17T06:27:19Z
dc.date.issued2008
dc.identifier.issn1521-3323
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13484
dc.sourceIIOimport
dc.titleBroadband material parameter characterization for practical high-speed interconnects on printed circuit board
dc.typeJournal article
dc.contributor.imecauthorDe Baets, Johan
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage649
dc.source.endpage656
dc.source.journalIEEE Transactions on Advanced Packaging
dc.source.issue3
dc.source.volume31
imec.availabilityPublished - open access


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