Show simple item record

Stress analysis on ultra thin ground wafers

dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorDe Munck, Koen
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorKnüttel, Alexander
dc.date.accessioned2021-10-17T06:38:16Z
dc.date.available2021-10-17T06:38:16Z
dc.date.issued2008
dc.identifier.issn1807-1953
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13563
dc.sourceIIOimport
dc.titleStress analysis on ultra thin ground wafers
dc.typeJournal article
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.source.peerreviewyes
dc.source.beginpage83
dc.source.endpage89
dc.source.journalJournal of Integrated Circuits and Systems
dc.source.issue2
dc.source.volume3
dc.identifier.urlhttp://www.sbmicro.org.br/jics/
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record