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Generic building blocks for 3D integration and their application on hybrid CMOS image sensors

dc.contributor.authorDe Munck, Koen
dc.date.accessioned2021-10-17T06:46:00Z
dc.date.available2021-10-17T06:46:00Z
dc.date.issued2008-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13613
dc.sourceIIOimport
dc.titleGeneric building blocks for 3D integration and their application on hybrid CMOS image sensors
dc.typePHD thesis
dc.contributor.imecauthorDe Munck, Koen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorMertens, Robert
dc.contributor.thesisadvisorVan Hoof, Chris
dc.identifier.urlhttps://repository.libis.kuleuven.be/dspace/handle/1979/1903
imec.availabilityPublished - open access


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