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Backside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration process

dc.contributor.authorDe Munck, Koen
dc.contributor.authorBogaerts, Jan
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorDe Moor, Piet
dc.contributor.authorSedky, Sherif
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-17T06:46:10Z
dc.date.available2021-10-17T06:46:10Z
dc.date.issued2008
dc.identifier.issn0013-5194
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13614
dc.sourceIIOimport
dc.titleBackside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration process
dc.typeJournal article
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewyes
dc.source.beginpage50
dc.source.endpage51
dc.source.journalElectronics Letters
dc.source.issue1
dc.source.volume44
imec.availabilityPublished - imec


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