dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Swinnen, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-17T07:54:50Z | |
dc.date.available | 2021-10-17T07:54:50Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13932 | |
dc.source | IIOimport | |
dc.title | Collective hybrid bonding for 3D stacking of ICs | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 77 | |
dc.source.endpage | 85 | |
dc.source.conference | 3D System Integration Conference - 3D-SIC | |
dc.source.conferencedate | 12/05/2008 | |
dc.source.conferencelocation | Tokyo Japan | |
imec.availability | Published - imec | |