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Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKeldermans, Johan
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorClaes, Martine
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-17T08:13:45Z
dc.date.available2021-10-17T08:13:45Z
dc.date.issued2008
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14002
dc.sourceIIOimport
dc.titleAlternative photoresist removal process to minimize damage of low-k material induced by ash plasma
dc.typeJournal article
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage6870
dc.source.endpage6874
dc.source.journalJapanese Journal of Applied Physics
dc.source.issue8
dc.source.volume47
imec.availabilityPublished - open access


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