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3D stacking of microwave modules for high-density packaging

dc.contributor.authorPosada Quijano, Guillermo
dc.date.accessioned2021-10-17T09:57:37Z
dc.date.available2021-10-17T09:57:37Z
dc.date.issued2008-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14335
dc.sourceIIOimport
dc.title3D stacking of microwave modules for high-density packaging
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorNauwelaers, Bart
dc.contributor.thesisadvisorMertens, Robert
imec.availabilityPublished - open access


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