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Direct hybrid bonding

dc.contributor.authorSwinnen, Bart
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Moor, Piet
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T11:06:40Z
dc.date.available2021-10-17T11:06:40Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14530
dc.sourceIIOimport
dc.titleDirect hybrid bonding
dc.typeBook chapter
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.bookWafer Level 3-D ICs Process Technology
imec.availabilityPublished - open access
imec.internalnotesSeries on Integrated Circuits and Systems


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