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High aspect ratio via etch development for Cu nails in 3-D-stacked ICs

dc.contributor.authorVan Aelst, Joke
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-10-17T11:31:07Z
dc.date.available2021-10-17T11:31:07Z
dc.date.issued2008
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14595
dc.sourceIIOimport
dc.titleHigh aspect ratio via etch development for Cu nails in 3-D-stacked ICs
dc.typeJournal article
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewyes
dc.source.beginpage3502
dc.source.endpage3506
dc.source.journalThin Solid Films
dc.source.issue11
dc.source.volume516
dc.identifier.urlwww.sciencedirect.com
imec.availabilityPublished - imec


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