Show simple item record

Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits

dc.contributor.authorVan Bavel, Mieke
dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-17T11:33:37Z
dc.date.available2021-10-17T11:33:37Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14602
dc.sourceIIOimport
dc.titleOptimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits
dc.typeJournal article
dc.contributor.imecauthorVan Bavel, Mieke
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorRuythooren, Wouter
dc.source.peerreviewno
dc.source.beginpage112
dc.source.endpage117
dc.source.journalFuture Fab
dc.source.issue27
dc.identifier.urlhttp://www.future-fab.com/documents.asp?d_ID=4546
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record