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On the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology

dc.contributor.authorCheng, Hsien-Chie
dc.contributor.authorChen, Wen-Hwa
dc.contributor.authorLin, Chieh-Sheng
dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorUang, Ruoh-Huey
dc.date.accessioned2021-10-17T21:33:58Z
dc.date.available2021-10-17T21:33:58Z
dc.date.issued2009
dc.identifier.issn1521-3323
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15086
dc.sourceIIOimport
dc.titleOn the thermal machanical behaviors of a novel nanowire based anisotropic conductive film technology
dc.typeJournal article
dc.source.peerreviewyes
dc.source.beginpage546
dc.source.endpage563
dc.source.journalIEEE Transactions on Advanced Packaging
dc.source.issue2
dc.source.volume32
imec.availabilityPublished - imec


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