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Controlling scratching in Cu chemical Journalmechanical planarization

dc.contributor.authorEusner, T.
dc.contributor.authorSaka, N.
dc.contributor.authorChun, J.H.
dc.contributor.authorArmini, Silvia
dc.contributor.authorMoinpour, M.
dc.contributor.authorFischer, P.
dc.date.accessioned2021-10-17T22:08:47Z
dc.date.available2021-10-17T22:08:47Z
dc.date.issued2009
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15286
dc.sourceIIOimport
dc.titleControlling scratching in Cu chemical Journalmechanical planarization
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageH528
dc.source.endpageH534
dc.source.journalJournal of the Electrochemical Society
dc.source.issue7
dc.source.volume156
imec.availabilityPublished - open access


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