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New hybrid bonding approach for 3D stacking of ICs

dc.contributor.authorJourdain, Anne
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T23:14:37Z
dc.date.available2021-10-17T23:14:37Z
dc.date.issued2009-08
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15552
dc.sourceIIOimport
dc.titleNew hybrid bonding approach for 3D stacking of ICs
dc.typeJournal article
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage24
dc.source.endpage28
dc.source.journalChip Scale Review Magazine
dc.source.issueAug._Sep.
dc.identifier.urlhttp://oliveexpress.com/Olive/oliveexpress/ox/?href=Sample/2009/09/08&view=document
imec.availabilityPublished - imec


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