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Selection of ESH solvents for the wet removal of post-etch photoresists in low-k dielectrics integration

dc.contributor.authorKesters, Els
dc.contributor.authorClaes, Martine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorBarthomeuf, Kevin
dc.contributor.authorLux, Marcel
dc.contributor.authorVereecke, Guy
dc.contributor.authorDurkee, John
dc.date.accessioned2021-10-17T23:24:24Z
dc.date.available2021-10-17T23:24:24Z
dc.date.issued2009
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15587
dc.sourceIIOimport
dc.titleSelection of ESH solvents for the wet removal of post-etch photoresists in low-k dielectrics integration
dc.typeJournal article
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewyes
dc.source.beginpage160
dc.source.endpage164
dc.source.journalMicroelectronic Engineering
dc.source.issue2
dc.source.volume86
imec.availabilityPublished - imec


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