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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.contributor.authorConard, Thierry
dc.contributor.authorKesters, Els
dc.contributor.authorLux, Marcel
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-17T23:50:31Z
dc.date.available2021-10-17T23:50:31Z
dc.date.issued2009
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15676
dc.sourceIIOimport
dc.titleRemoval of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
dc.typeJournal article
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage181
dc.source.endpage185
dc.source.journalMicroelectronic Engineering
dc.source.issue2
dc.source.volume86
imec.availabilityPublished - open access


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