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Electrodeposition for 3D integration. Investigating copper electrodeposition for 'through-silicon via' applications

dc.contributor.authorLuhn, Ole
dc.date.accessioned2021-10-18T00:17:04Z
dc.date.available2021-10-18T00:17:04Z
dc.date.issued2009-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15764
dc.sourceIIOimport
dc.titleElectrodeposition for 3D integration. Investigating copper electrodeposition for 'through-silicon via' applications
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorCelis, Jean-Pierre
dc.contributor.thesisadvisorVan Hoof, Chris
imec.availabilityPublished - open access


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