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Electrodeposition of copper tetracyanoquinodimethane (CuTCNQ) for bipolar resistive switching non-volatile memories

dc.contributor.authorMuller, Robert
dc.contributor.authorRouault, Olivier
dc.contributor.authorKatzenmeyer, Aaron
dc.contributor.authorGoux, Ludovic
dc.contributor.authorWouters, Dirk
dc.contributor.authorGenoe, Jan
dc.contributor.authorHeremans, Paul
dc.date.accessioned2021-10-18T01:01:29Z
dc.date.available2021-10-18T01:01:29Z
dc.date.issued2009-10
dc.identifier.issn1364-503X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15900
dc.sourceIIOimport
dc.titleElectrodeposition of copper tetracyanoquinodimethane (CuTCNQ) for bipolar resistive switching non-volatile memories
dc.typeJournal article
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorGenoe, Jan
dc.contributor.imecauthorHeremans, Paul
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecGenoe, Jan::0000-0002-4019-5979
dc.contributor.orcidimecHeremans, Paul::0000-0003-2151-1718
dc.source.peerreviewyes
dc.source.beginpage4191
dc.source.endpage4201
dc.source.journalPhilosophical Transactions of the Royal Society A
dc.source.issue1905
dc.source.volume367
dc.identifier.urlhttp://dx.doi.org/10.1098/rsta.2008.0300
imec.availabilityPublished - imec


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