Show simple item record

TSV first and last: through-Si via technologies for 3D SIC and 3D WLP - part 2

dc.contributor.authorProvoost, Jan
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T01:57:41Z
dc.date.available2021-10-18T01:57:41Z
dc.date.issued2009-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16060
dc.sourceIIOimport
dc.titleTSV first and last: through-Si via technologies for 3D SIC and 3D WLP - part 2
dc.typeJournal article
dc.contributor.imecauthorProvoost, Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.journalElectroIQ
dc.identifier.urlhttp://www.electroiq.com/index/display/packaging-article-display/351021/s-articles/s-advanced-packaging/s-packag
imec.availabilityPublished - imec
imec.internalnoteshttp://www.electroiq.com/index/display/packaging-article-display/351021/articles/advanced-packaging/packaging0/3d-integration0/tsv/2009/01/tsv-first-and-last-through-si-via-technologies-for-3d-sic-and-3d-wlp.html


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record