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Through-Si via (TSV) technology – weighting the technology and costs

dc.contributor.authorProvoost, Jan
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T01:58:01Z
dc.date.available2021-10-18T01:58:01Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16061
dc.sourceIIOimport
dc.titleThrough-Si via (TSV) technology – weighting the technology and costs
dc.typeJournal article
dc.contributor.imecauthorProvoost, Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage36
dc.source.endpage38
dc.source.journalSemiconductor International China
dc.source.issue6
dc.identifier.urlhttp://mag.sichinamag.com/Show/200907
imec.availabilityPublished - imec


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