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Airgaps for interconnects: Ready to go?

dc.contributor.authorBeyer, Gerald
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-18T15:20:50Z
dc.date.available2021-10-18T15:20:50Z
dc.date.issued2010
dc.identifier.issn0038-111X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16742
dc.sourceIIOimport
dc.titleAirgaps for interconnects: Ready to go?
dc.typeJournal article
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorTokei, Zsolt
dc.source.peerreviewno
dc.source.beginpage39
dc.source.endpage40
dc.source.journalSolid State Technology
dc.source.issue6
dc.source.volume53
dc.identifier.urlhttp://online.qmags.com/SST0610
imec.availabilityPublished - imec


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