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Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages

dc.contributor.authorIvankovic, Andrej
dc.contributor.authorVanstreels, Kris
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBrizar, Guy
dc.contributor.authorGillon, Renaud
dc.contributor.authorBlansaer, Eddy
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-18T17:19:54Z
dc.date.available2021-10-18T17:19:54Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17310
dc.sourceIIOimport
dc.titleDevelopment of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
dc.typeProceedings paper
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conference11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE
dc.source.conferencedate26/04/2010
dc.source.conferencelocationBordeaux France
imec.availabilityPublished - imec


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