Electrical modeling and characterization of through silicon via for three-dimensional ICs
dc.contributor.author | Katti, Guruprasad | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | De Meyer, Kristin | |
dc.contributor.author | Dehaene, Wim | |
dc.date.accessioned | 2021-10-18T17:33:21Z | |
dc.date.available | 2021-10-18T17:33:21Z | |
dc.date.issued | 2010 | |
dc.identifier.issn | 0018-9383 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17354 | |
dc.source | IIOimport | |
dc.title | Electrical modeling and characterization of through silicon via for three-dimensional ICs | |
dc.type | Journal article | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | De Meyer, Kristin | |
dc.contributor.imecauthor | Dehaene, Wim | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 256 | |
dc.source.endpage | 262 | |
dc.source.journal | IEEE Transactions on Electron Devices | |
dc.source.issue | 1 | |
dc.source.volume | 57 | |
imec.availability | Published - open access |