The microstructural aspect of the ductile-to-brittle transition of Tin-based lead-free solders
| dc.contributor.author | Lambrinou, Konstantza | |
| dc.contributor.author | Engelmaier, Werner | |
| dc.date.accessioned | 2021-10-18T17:56:15Z | |
| dc.date.available | 2021-10-18T17:56:15Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17425 | |
| dc.source | IIOimport | |
| dc.title | The microstructural aspect of the ductile-to-brittle transition of Tin-based lead-free solders | |
| dc.type | Journal article | |
| dc.source.peerreview | no | |
| dc.source.beginpage | JAI103064 | |
| dc.source.journal | Journal of ASTM International | |
| dc.source.issue | 7 | |
| dc.source.volume | 7 | |
| imec.availability | Published - imec |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
|
There are no files associated with this item. |
|||