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Using 3D ICs for manycore architectures – the communication challenge

dc.contributor.authorLauwers, Lode
dc.date.accessioned2021-10-18T18:04:00Z
dc.date.available2021-10-18T18:04:00Z
dc.date.issued2010-07
dc.identifier.issn1363-5182
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17451
dc.sourceIIOimport
dc.titleUsing 3D ICs for manycore architectures – the communication challenge
dc.typeJournal article
dc.contributor.imecauthorLauwers, Lode
dc.source.peerreviewno
dc.source.beginpage18
dc.source.journalFuture Fab International
dc.source.issue34
dc.identifier.urlhttp://www.future-fab.com/content/PDF/FF34_L_Intro_NTDS.pdf
imec.availabilityPublished - imec


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