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Monitoring the superfilling of blind holes with electrodeposited copper

dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-18T18:33:50Z
dc.date.available2021-10-18T18:33:50Z
dc.date.issued2010
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17538
dc.sourceIIOimport
dc.titleMonitoring the superfilling of blind holes with electrodeposited copper
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpageD242
dc.source.endpageD247
dc.source.journalJournal of the Electrochemical Society
dc.source.issue4
dc.source.volume157
imec.availabilityPublished - open access


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