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Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorArmini, Silvia
dc.contributor.authorRichard, Olivier
dc.contributor.authorMaes, Guido
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorWhelan, Caroline M.
dc.contributor.authorTravaly, Youssef
dc.date.accessioned2021-10-18T18:36:52Z
dc.date.available2021-10-18T18:36:52Z
dc.date.issued2010
dc.identifier.issn1616-301X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17546
dc.sourceIIOimport
dc.titleBottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1125
dc.source.endpage1131
dc.source.journalAdvanced Functional Materials
dc.source.issue7
dc.source.volume20
imec.availabilityPublished - open access


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