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Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance

dc.contributor.authorNagar, Magi
dc.contributor.authorVaes, Jan
dc.contributor.authorEin-Eli, Yair
dc.date.accessioned2021-10-18T19:28:02Z
dc.date.available2021-10-18T19:28:02Z
dc.date.issued2010
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17679
dc.sourceIIOimport
dc.titlePotassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
dc.typeJournal article
dc.source.peerreviewyes
dc.source.beginpage2810
dc.source.endpage2816
dc.source.journalElectrochimica Acta
dc.source.issue8
dc.source.volume55
imec.availabilityPublished - imec


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