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Thermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking

dc.contributor.authorOkoro, Chukwudi
dc.date.accessioned2021-10-18T19:47:33Z
dc.date.available2021-10-18T19:47:33Z
dc.date.issued2010-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17727
dc.sourceIIOimport
dc.titleThermo-mechanical characterization of copper through-silicon-via intercnnect for 3D chip stacking
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorVandepitte, D.
dc.contributor.thesisadvisorVan Hoof, Chris
imec.availabilityPublished - open access


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