dc.contributor.author | Perruisseau-Carrier, Julien | |
dc.contributor.author | Mazza, Marco | |
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Skrivervik, Anja | |
dc.contributor.author | Ionescu, Adrian | |
dc.contributor.author | Tilmans, Harrie | |
dc.date.accessioned | 2021-10-18T20:14:23Z | |
dc.date.available | 2021-10-18T20:14:23Z | |
dc.date.issued | 2010 | |
dc.identifier.issn | 1521-3323 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17795 | |
dc.source | IIOimport | |
dc.title | Electrical modeling and design of a wafer-level package for MEM resonators | |
dc.type | Journal article | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Tilmans, Harrie | |
dc.contributor.orcidimec | Tilmans, Harrie::0000-0003-4240-4962 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 534 | |
dc.source.endpage | 542 | |
dc.source.journal | IEEE Transactions on Advanced Packaging | |
dc.source.issue | 2 | |
dc.source.volume | 33 | |
imec.availability | Published - open access | |