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3D Chips: stacked 2D, or a chance to make smarter designs?

dc.contributor.authorProvoost, Jan
dc.date.accessioned2021-10-18T20:34:33Z
dc.date.available2021-10-18T20:34:33Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17845
dc.sourceIIOimport
dc.title3D Chips: stacked 2D, or a chance to make smarter designs?
dc.typeJournal article
dc.contributor.imecauthorProvoost, Jan
dc.source.peerreviewno
dc.source.beginpage12
dc.source.journalMEPTEC Report
dc.source.issue3
dc.source.volume14
dc.identifier.urlhttp://www.meptec.org/Resources/MEPTEC%20Report%2014.3.pdf
imec.availabilityPublished - imec


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