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SmartSamples – Lowering integration risks for 3D TSV products

dc.contributor.authorProvoost, Jan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.date.accessioned2021-10-18T20:35:40Z
dc.date.available2021-10-18T20:35:40Z
dc.date.issued2010-07
dc.identifier.issn1363-5182
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17848
dc.sourceIIOimport
dc.titleSmartSamples – Lowering integration risks for 3D TSV products
dc.typeJournal article
dc.contributor.imecauthorProvoost, Jan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.source.peerreviewno
dc.source.beginpage47
dc.source.endpage51
dc.source.journalFuture Fab International
dc.source.issue34
dc.identifier.urlhttp://www.future-fab.com/content/PDF/FF34_L_WP_Provoost_DIPI.pdf
imec.availabilityPublished - imec


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