Show simple item record

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

dc.contributor.authorSoussan, Philippe
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorPhommahaxay, Alain
dc.date.accessioned2021-10-18T21:50:47Z
dc.date.available2021-10-18T21:50:47Z
dc.date.issued2010-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18022
dc.sourceIIOimport
dc.titleCu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
dc.typeBook chapter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage4
dc.source.bookSuss Report
dc.source.endpage5
imec.availabilityPublished - imec


Files in this item

Thumbnail
Name:
22134.pdf
Size:
2.561Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record