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Study of origin, impact and solutions of processing damage in low dielectric constant materials for advanced interconnect applications

dc.contributor.authorUrbanowicz, Adam
dc.date.accessioned2021-10-18T22:33:13Z
dc.date.available2021-10-18T22:33:13Z
dc.date.issued2010-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18113
dc.sourceIIOimport
dc.titleStudy of origin, impact and solutions of processing damage in low dielectric constant materials for advanced interconnect applications
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorDe Gendt, Stefan
dc.contributor.thesisadvisorHeyns, Marc
imec.availabilityPublished - open access


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