dc.contributor.author | Yang, Yu | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Richard, Olivier | |
dc.contributor.author | Bender, Hugo | |
dc.contributor.author | Zhao, Chao | |
dc.contributor.author | Verlinden, Bert | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2021-10-19T00:42:19Z | |
dc.date.available | 2021-10-19T00:42:19Z | |
dc.date.issued | 2010 | |
dc.identifier.issn | 1099-0062 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18382 | |
dc.source | IIOimport | |
dc.title | The impact of back-side Cu contamination on 3D stacking architecture | |
dc.type | Journal article | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Richard, Olivier | |
dc.contributor.imecauthor | Bender, Hugo | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Richard, Olivier::0000-0002-3994-8021 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | H39 | |
dc.source.endpage | H41 | |
dc.source.journal | Electrochemical and Solid-State Letters | |
dc.source.issue | 2 | |
dc.source.volume | 13 | |
imec.availability | Published - open access | |