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3D interconnect technology for out-of-plane biomedical probe arrays: a modular approach with slim-base solutions

dc.contributor.authorAarts, Arno
dc.date.accessioned2021-10-19T12:28:13Z
dc.date.available2021-10-19T12:28:13Z
dc.date.issued2011-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18436
dc.sourceIIOimport
dc.title3D interconnect technology for out-of-plane biomedical probe arrays: a modular approach with slim-base solutions
dc.typePHD thesis
dc.contributor.imecauthorAarts, Arno
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorPuers, Bob
dc.contributor.thesisadvisorVan Hoof, Chris
imec.availabilityPublished - open access


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