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Cu electrodeposition on resistive substrates in alkaline chemistry: effect of current density and wafer RPM

dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-19T12:29:27Z
dc.date.available2021-10-19T12:29:27Z
dc.date.issued2011
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18486
dc.sourceIIOimport
dc.titleCu electrodeposition on resistive substrates in alkaline chemistry: effect of current density and wafer RPM
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpageD390
dc.source.endpageD394
dc.source.journalJournal of the Electrochemical Society
dc.source.issue6
dc.source.volume158
imec.availabilityPublished - imec


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